The chipmaker is going after Intel in technical computing workloads with a refreshed lineup of EPYC CPUs that use 3D chiplet technology to triple the L3 cache, which will speed up performance ...

But a few weeks ago, Cadence took things a significant step further, and actually architected, designed, and taped out what the company calls the industry’s first Arm-based system chiplet ...

AMD EPYC 7003 Series processors with 3-D V-Cache ... than 200X the interconnect densities compared with on-package 2-D chiplet interconnects, and more than 15X the interconnect densities of ...

Introduces support for the latest interconnect standards, including Universal Chiplet Interconnect Express™ (UCIe™) 2.0 and Open Compute Project Bunch of Wires (BoW). Enhances Keysight’s EDA ...

Advanced Micro Devices AMD is set to release its fourth-quarter 2024 results on Feb. 4. Find the latest EPS estimates and ...

“To address increasing compute demand from recent multi-model workloads with heavy models like large language models, we propose to deploy heterogeneous chiplet-based multi-chip module (MCM)-based ...

For starters, AMD's modular chiplet design wouldn't work as intended ... AMD first engineered Infinity Fabric for use in its EPYC server line of CPUs and later implemented it on its consumer ...

Ultra-low latency UCIe controller for standard industry chiplet interoperability on streaming, PCIe, and CXL protocols The Cadence UCIe™ Controller is a high-bandwidth, low-power and low-latency ...

SAN DIEGO--(BUSINESS WIRE)--Emphasis is on AI applications. The third annual Chiplet Summit, to occur on January 21-23 at the Santa Clara Convention Center, has now set its final keynote schedule.

Introducing OPENEDGES’ Universal Chiplet Interconnect Express (UCIe) Controller IP, OUC, designed to transform the semiconductor landscape with innovative multi-chiplet designs. This UCIe chiplet ...

META alone employed more than 1.5 million AMD EPYC CPUs globally to power its social media platforms. NET selected general X processors with AMD’s 3D chiplet stacking technology to power its ...